Get Involved

Exhibit Opportunities
Past Exhibitors

Exhibitors

Exhibit packages for Automotive Sensors and Electronics Expo 2017 are available. For further information and questions about exhibiting, please click here.

Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages. Our focus is on the following market segments: smartcards and discrete packages, MEMS and sensor packages, leadless and substrate-based packages, and special application packages. We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market.


Furuya Metal’s core products consist of precious metals (platinum, iridium and ruthenium, gold, and silver). One of our main products is sputtering targets, essential to MEMS/sensor production, as interconnects and electrodes. Furuya works aggressively to develop materials for the next generation of semiconductors and to provide high-purity and high-density targets, utilizing our technology of refining precious metals. We propose products which have less particles and superior uniformity performance by controlling and customizing the size of particles and orientation. Our in-house sputtering instruments enable us to inspect characteristics of thin films and develop various alloy thin films. We offer Ruthenium (Ru), Platinum (Pt), and Iridium (Ir) targets and more for MEMS applications. We are open to collaborative research on products in new applications and environments. Please come visit our booth or visit our website for more information.


Intertek is more than a testing and certification laboratory – we are a partner, helping our clients to meet the necessary requirements for any regulatory environment or global market. Throughout our network of 1000+ accredited laboratories, Intertek offers a variety of automotive and transportation services, including assurance, testing, inspection, and consulting. Intertek performs testing around the world for most major OEMs and Tier Suppliers to ensure they meet applicable standards and can get to market quickly and with confidence. We help our customers to meet end users’ expectations for safety, sustainability, performance, integrity and desirability.


Nordson EFD is a leading manufacturer and global supplier to the automotive industry of high­quality, reliable solder pastes, tacky paste fluxes and thermal interface materials. EFD SolderPlus® dispensable solder pastes deliver consistent, repeatable deposit sizes down to 0.004” in diameter. It is packaged in EFD industrial-grade, silicone-free syringe barrels for efficient top­to­bottom dispensing. EFD PrintPlus® pastes deliver superior batch-to-batch consistency, extended stencil print life, long pause-to­print capability, and excellent wetting performance. EFD thermal interface material is silicone-free, has the lowest thermal resistance formula on the market and does not dry, harden, or degrade. Our materials are generally made-to-order and we’re known for consistent on-time delivery. Nordson EFD is an ISO 9001:2008 manufacturer.


Since it was founded in 1904 with the aim of manufacturing western-style dinnerware, Noritake has ventured into new businesses with a focus on ceramics technologies. Through our four business groups we now provide a wide variety of products and technologies ranging from dinnerware to the products for core and high-tech industries such as automotive, steel, energy including solar cells, electronics, etc.


Plan Optik AG is the leading manufacturer of structured wafers when it comes to technology. In sectors such as consumer electronics, automotive, aerospace, chemistry and pharmaceuticals, these wafers are essential components used as active elements for numerous applications in MEMS technology. The wafers of glass, glass-silicon compounds or quartz are available in sizes up to 300 mm diameter. Wafers by Plan Optik provide high-precision surfaces in the ångström range, which are achieved through the use of the MDF polishing process developed by the company. Plan Optik wafers are available to minimum tolerances with application-specific structuring and complex material combinations. Plan Optik AG's extensive experience in the integration of optical, electronic or chemical functions within a wafer as the basis of MEMS applications has made the company the preferred partner of large international manufacturers.


Renesas Electronics delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live—securely and safely. The number one global supplier of microcontrollers, and a leader in analog & power and SoC products, Renesas provides the expertise, quality, and comprehensive solutions for a broad range of automotive, industrial, home electronics, office automation and information communication technology applications to help shape a limitless future.


We develop and provide high-performance materials that take customer products even further. Sekisui utilizes its unique fine particle, adhesion and precise synthesis technologies to develop and provide high-performance and intermediate materials for a wide variety of fields such as electronics, automobiles and transportation, buildings and infrastructures, life sciences and industry, etc. Sekisui supplies advanced materials that include products such as conductive fine particles and liquid crystal sealants where we have the leading share of the global market, and also ITO films, photosensitive materials, semiconductor materials.


The Shin-Etsu Group, utilizing resources from multiple divisions, offers an extensive product line of traditional packaging materials and materials for advanced packaging. Shin-Etsu MicroSi is the leader in thermal interface material, and we have developed an extensive line of molding compounds, encapsulents, silicon and epoxy coatings along with die attachment material. The quality of our thermal interface material is among the most advanced in semiconductor manufacturing and has a wide range of use in thermal interface material applications, some of which include thermal gels and grease, phase change materials, and high hardness silicone rubber pads.


Since 1974, Sonoscan, the leader in acoustic microscopy (AM), has manufactured systems in the USA and regional support laboratories in Asia, Europe and the USA for AM services. Sonoscan’s proprietary C-SAM® technologies have set the standard for over 40 years. Sonoscan provides non-destructive analysis for process control and quality assurance to safeguard your MEMS products as it accurately detects defects and process variations. Sonoscan offers instruments for the laboratory and automated test systems for front, mid and back-end microelectronics, including the AW series for various wafer configurations and the FACTS2™ DF2400™ for scanning MEMS devices in trays. Collaboration with Sonoscan customers and industries has led to many innovations, patents and standards over the years. Specific to the MEMS industry, transducers were developed and built by Sonoscan for bonded wafers, hermetic/cap seal, lab-on-chip and MEMS packaging inspection, plus automated accept/reject methods for die and cavity seal mapping of a wafer.


TASS International supports the global automotive industry in the creation of safer and smarter vehicles and is known for its unique development methodology, offering a set of advanced simulation software tools, tailor made engineering solutions and state-of-the-art testing and certification facilities and services, with the aim to improve integrated safety systems of vehicles and boost the development of highly automated- and connected driving. TASS International helps to develop better products, increased speed-to-market and more robust and cost-effective development processes. TASS International is a leading organization and has a history of more than 25 years, employing 200 people in 11 countries worldwide. Headquartered in Helmond in The Netherlands, it operates several laboratories, under which is a unique facility for testing and validation of intelligent transportation systems and cooperative driving technologies. Its software brands, PreScanTM, Delft-TyreTM and MADYMOTM, are familiar names to the OEMs and to suppliers in the automotive industry.


UBOTIC Company Limited provides advanced MEMS & sensor package integration from prototype to production with a focus on low cost open-tool and custom cavity packaging as well as custom housing/lid design and fabrication. We provide lead-frame and substrate design along with fabrication of molded air cavity QFN packages (AQFN), LGA, SOIC cavity, custom lids, molded housing, SIP. Specializing in custom design and materials to meet today’s product environments from harsh automotive and medical to industrial and consumer. Additional services include both thermal and electrical modeling along with package qualification and reliability testing. The factory is certified in TS16949:2009 and ISO9001-2008.


Exhibit Opportunities

To ensure a more exclusive and intimate networking environment for both the exhibitors and the attendees, the exhibits will only be open to conference attendees. The exhibit package is only $995 and includes the following:

  • One (1) conference pass
  • Printed conference program and presentation slides in electronic format
  • One (1) 6-foot table, draped
  • Two (2) chairs
  • Custom 11”x17” tabletop sign with company logo and description
  • Company logo and description in the printed conference program and on printed conference signage
  • Company logo and description on event website
  • Company logo and description on event dedicated email to subscribers of MEMS Journal and our media partners; event promotions will reach 70,000 to 80,000 individuals in the automotive, sensors, electronics, MEMS, and semiconductor industry segments.

Upgrade to the Deluxe Exhibitor option which enables you to give a 10-minute talk to the entire audience during the Technology Showcase. It's a great way to draw more attention to your company. Deluxe Exhibitor and Technology Showcase spots are limited – click here to register today!

For further information about the exhibits, please contact Jessica Ingram at jessica@memsjournal.com or call at 360-929-0114.

Exhibit space is limited. Sign up today!


Past Exhibitors

Many thanks to our exhibitors from the 2013-2016 events.


Allion is a leader in flexible and innovative product testing and validation. We have the expertise and infrastructure to tackle a wide range of technologies. Our real-world testing environments allow our clients to see how their product performs in the places their customers use it most. For other challenges, Allion engineers combine their technical skills and creativity to develop new testing methods that fit your product. We use resources such as our partnership with Cinder Solutions to build the necessary tools for all kinds of product validation. No matter what stage of the development process you are in, we’re ready to help.


Alpha Assembly Solutions is the world leader in the development, manufacture and sales of innovative materials used in the electronics assembly process. Alpha is a supplier of assembly materials for automotive electronics including solder paste, cored solder wire, bar solder and fluxes, as well as semiconductor packaging materials and stencils. Alpha’s commitment to ground-breaking R&D, supported by a global network of applications engineering experts is aligned to the needs of the automotive industry’s demand for high reliability, whilst improving efficiency and reducing costs. Armed with an intimate knowledge of materials and processes, we are uniquely qualified to provide you with the total process solutions you are looking for. Alpha’s products can increase reliability and reduce assembly and warranty costs in the following areas of automotive assembly: powertrain / chassis electronics; vision and detection systems; exterior lighting, in-cabin electronics.

Alpha’s unique solutions to enable Tier 1 suppliers to meet their design and cost targets with novel solutions which deliver the lowest total cost of ownership. Additional information is available at www.alphaassembly.com/Markets/Automotive.


Pioneering ultrasonic machining of glass wafers for automotive sensors at Ford, Chrysler and GM since 1978. Alpha Precision’s continuous improvement of our custom ultrasonic machining process for wafer features and our high precision surface polishing process results in excellent anodic bonding to silicon for MEMS. The ultrasonic process provides high precision placement and tolerances of features on the MEMS wafer. Ultrasonic machining does not impart any substrate cracking, stress or temperature change. This process is applicable to many different brittle substrates such as glass and ceramic. End use features include through vias, cavities and channels. ISO/TS 16949:2009 Certified Quality Process.

Alpha Precision also does specialty MicroBlast machining of many different shapes and sizes.


ams is a global leader in the design and manufacture of advanced sensor solutions and analog ICs. Our mission is to shape the world with sensor solutions by providing a seamless interface between humans and technology. ams’ high-performance analog products drive applications requiring extreme precision, dynamic range, sensitivity, and ultra-low power consumption. Products include sensors, sensor interfaces, power management and wireless ICs for consumer, communications, industrial, medical, and automotive markets.

With headquarters in Austria, ams employs over 1,700 people globally and serves more than 8,000 customers worldwide. ams is listed on the SIX Swiss stock exchange (ticker symbol: AMS). More information about ams can be found at http://www.ams.com. Follow us on twitter or share with LinkedIn.


Audio Precision is the recognized standard in audio test. For over thirty years, AP has offered high-performance audio analyzers, accessories and applications to help engineers worldwide design, validate, characterize and manufacture consumer, professional and industrial audio products. Ongoing innovation has been a key theme for the organization since its founding, with market-leading THD+N performance, a wide range of digital interfaces, software that combines power with ease-of-use, and tools for electro-acoustic and perceptual audio testing. Headquartered in Beaverton, Oregon, AP is part of the high-tech “Silicon Forest” of the greater Portland metropolitan area.


AutoHarvest Foundation, a 501(C)3 nonprofit, created and operates a unique innovation ecosystem led by some of the most highly respected figures in the automotive and manufacturing industries. In 2012, AutoHarvest.org was launched as the world’s only truly neutral and global on-line meeting place for innovators of all types with an interest in advanced manufacturing. This system allows users of all types to showcase capabilities, technologies and needs system-wide and then privately connect with fellow inventors and commercializers to explore technology and business development opportunities of mutual interest. The AutoHarvest interest group consists of over 250 prominent R&D and manufacturing organizations from industry, government and academia. Recently awarded a multi-year grant by the New Economy Initiative Foundation of Southeast Michigan, AutoHarvest is part of the Detroit Regional Innovation Network. For more information visit: http://www.autoharvest.org


Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages. Our focus is on the following market segments: smartcards and discrete packages, MEMS and sensor packages, leadless and substrate-based packages, and special application packages. We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market.


Precision machining of hard, brittle materials including glass, sapphire, quartz, silicon carbide and other advanced technical ceramics. Supplier of both machined and polished borosilicate glass wafers for MEMS, microfluidic, life sciences, photonics, and sensor applications. Unique approach to difficult applications through ultrasonic machining, abrasive jet machining and other conventional machining methods to achieve micro features and tight tolerance parts for a variety of applications. Prototype through production - advanced metrology capabilities and ISO 9001-2008.


CEP Technologies Corporation is an engineering based, high precision, high volume, progressive metal stamping company with global capabilities. For 50 years, CEP has been a family owned and operated customer driven manufacturer that continually evolves its methods and systems to adapt to its market place in order to achieve total customer satisfaction. CEP has grown with a diverse customer base to serve telecommunications, automotive OEM and aftermarket, semiconductor, circuit and surge protection, computer and switch industries. We pride ourselves on being an ISO/TS 16949:2009 certified company for many years. We produce stampings with low and high volumes. Volumes per part can range from 50,000 to 50,000,000 pieces per year. Our service is backed up with excellent, consistent quality and competitive pricing. We make sure that your finished parts meet and exceed your requirements. We combine people with extensive experience, knowledge of the industry, with superior design and manufacturing capabilities. We consider ourselves to be the "next generation in precision metal stampings".


CeramTec GmbH is a global leading supplier of technical ceramics and specializes in the development, production, and distribution of innovative ceramic components. CeramTec's seven core divisions in Germany, along with various subsidiaries around the world, supply major markets including electronics, telecommunications, automotive, medical, machinery, metalworking, and chemical industries. With more than 100 years of experience in the technical ceramics field, CeramTec plays a leading role in "Innovative Ceramic Engineering". Within the CeramTec Group, the Multifunctional Ceramics and Electronics Divisions play a critical role in the automotive and sensors market. The Multifunctional Ceramics Division produces piezoelectric ceramics that are used for a variety of automotive sensors and actuators that range from distance control, vibration sensing, fuel injection, and other ultrasonic applications. The Electronics Division delivers ceramic circuitry boards, Zirconia tapes, and custom shaped ceramics that are utilized to remove heat from todays high powered and complex circuitry, lights, and power modules. Through the utilization of CeramTec's core divisions and vast experience, a technical ceramic solution for most applications is certainly attainable.


Freescale is a global semiconductor company enabling the Internet of Tomorrow. We develop solutions to provide secure efficient connections, safer and greener automobiles, and add intelligence to everyday items. As a leader in processing and sensing solutions, we are driving a more innovative and connected world for the future.


Precious metal reclaim & refining - refiners of platinum, gold, silver, palladium, rhodium generated from solder dross, thick & thin film paste, gold wire, heat shields, jewelry, dental appliances, etc. Geib Refining is ITAR & ISO compliant.

Our clientele ranges from the US Federal Government to defense contractors to industrial plants to jewelry manufacturers to small R&D facilities. No matter what the originating source, the commonality for lot settlements begins with 100% processing and highly accurate sampling and assaying. Whether it's melting, incineration, milling, chemical stripping, or solutions recovery, all of your material is processed at Geib and professionally controlled. As a precious metals generator, you must demand homogeneous refining; we meet your demands on each and every lot.


Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s high-speed, fully automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon). The company also recently launched NEW heavy wire and ribbon bonding services to support early stage product development including heavy wire and ribbon bonding process support, development and production of prototypes and pre-production manufacturing.


Huntsman Advanced Materials is a leading global chemical solutions provider with a long heritage of pioneering technologically advanced epoxy, acrylic and polyurethane-based polymer products. Our legacy of technology innovation and expertise in high-performance adhesives and composites enable us to develop products and solutions which are formulated to satisfy your specific project requirements.


Indium Corporation is a premier materials supplier to the global electronics, semiconductor, thin film, thermal management, and solar markets. Products include solders, and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.


InnoState seeks to supplement the region’s traditional parts-making economy with a fast-growing community of firms pursuing a different business model. InnoState is comprised of regional organizations well-positioned to support the cluster’s development and growth, including the Workforce Intelligence Network (WIN), Detroit Regional Chamber, the Michigan Manufacturing Technology Center (MMTC) and the National Center for Manufacturing Sciences (NCMS).


INTERMARK (USA), INC. (IM) was established in 1990, as the USA branch operation for KITAGAWA Industries Co., LTD (KG). The product lines comprise of EMI solutions, thermal management components, vibration and shock management parts, and plastic components. EMI solutions include a wide range of EMI absorbers, ferrite cores, EMI shielding components, and grounding parts. Our research and development activity is focused on the continuous improvement of product quality levels and dynamic adaptability to the specific evolution of the market. INTERMARK (USA), INC. is committed to continue its efforts to support customers, meet their requirements, and supply the most effective solutions for the increased levels of EMI shielding required today by the new international EMC regulations for computers, office equipment, telecommunication systems, local area networking, medical devices, digital imaging systems, automotive and aircraft equipment.


Invenios designs, develops, and manufactures microfluidics, MEMS, and 3D microstructures. The company also engineers exclusive processes and custom production equipment that is required to manufacture this range of products. Invenios has a fully capable microfluidics/MEMS foundry that offers high performance, cost effective solutions for both established and emerging companies. Unlike traditional microsystems foundries, Invenios delivers a complete production cycle, which includes design review, process development, manufacturing, and testing within an ISO 9001 environment to support a broad range of micron and sub-micron level products.


InvenSense, Inc. is the leading provider of intelligent sensor system on chip (SoC) for motion and sound solutions found in mobile, wearables, smart home, industrial, and automotive products. The company’s patented InvenSense Fabrication Platform and patent-pending MotionFusion™ technology address the emerging needs of many mass-market consumer applications via improved performance, accuracy, and intuitive motion-, gesture- and sound-based interfaces.


MicroGen Systems, Inc. is developing a suite of products based on its proprietary piezoelectric vibrational energy harvester (PZEH) technology. These low cost, long lifetime (>20 years) micro-electromechanical systems (MEMS) are micro-power sources that extend rechargeable battery lifetime or will eliminate the need for batteries altogether. Applications include the consumer, military, industrial, automotive and commercial industries.


Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices.


Merit Sensor Systems, Inc., founded in 1991, designs, manufactures, assembles and packages customized MEMS piezoresistive pressure sensor solutions for medical, automotive, industrial, aviation, defense and consumer applications. Merit Sensor offers uncompensated, passively compensated, and actively compensated MEMS pressure sensing elements ranging from 0.15 to 15,000 psi operating ranges. Merit Sensor Systems is located in Salt Lake City, Utah, and is a subsidiary of Merit Medical Systems, Inc. (NASDAQ: MMSI).


MicroGen is bringing to market a suite of products based on its proprietary piezoelectric micro-electro-mechanical systems (piezo-MEMS) platform technology which was developed at Cornell University (www.cnf.cornell.edu) from which energy harvesting devices and sensors can be designed, integrated and manufactured. This piezo-MEMS platform has been transferred to X-FAB MEMS Foundry (www.xfab.com) located in Itzehoe, north of Hamburg, Germany.

MicroGen’s first piezo-MEMS product is a small (volume 0.05 to 1.3 cm3; smaller than a green pea) vibrational energy harvester or micro-power generator (MPG). An MPG is used as the ‘heart’ of MicroGen’s BOLT™ Power Cell DC power source product. These low cost, long lifetime, highly robust products scavenge otherwise wasted ambient vibrational energy will replace or extend the lifetime of batteries in wireless sensor applications.

MicroGen’s primary target market is the industrial and building markets - e.g. process automation, machinery monitoring, lighting control, HVAC, smart utility metering, and many others. In addition, DoD applications will be sought. Longer term, MicroGen’s secondary market is transportation systems - e.g. planes, trains and automobiles, civil infrastructure monitoring, asset tracking and numerous others.

MicroGen located in Rochester, NY. MicroGen is led by a strong international management team, Board of Directors and Advisory Board with significant semiconductor and MEMS industry and start-up company experience.


The National Nanotechnology Infrastructure Network (NNIN) is an integrated network of user facilities, supported by the National Science Foundation, serving the needs of nanoscale science, engineering and technology researchers across the country. The goal of the NNIN is to enable rapid advancement in science and engineering at the nanoscale by providing researchers with efficient access to nanotechnology infrastructure (fabrication, characterization and computational capabilities and facilities) and support from experienced staff members.

The Lurie Nanofabrication Facility (LNF) at the University of Michigan is one of the NNIN sites that offers 24/7 semiconductor processing capabilities on production-level equipment supported by a professional staff. With 1,160 m2 (12,500 ft2) of ISO class 4/5/6 and 7 (Class 10/100/1000 and 10,000) cleanrooms for processing pieces, 100 mm and 150 mm wafers, we have processing capabilities for silicon and organic devices, MEMS and bioMEMS, fluidics and biofluidics, and nanoimprint technologies.

With such an available suite of established technologies for a large range of applications, the LNF is ideal for rapid feasibility assessment of ideas and pilot/low-volume products. Whether you want to assess new process adjustments for your product without compromising your current process, explore new device directions, or simply take advantage of our advanced characterization capabilities, the LNF provides the complete cleanroom experience for your high tech needs. The LNF is also part of the National Nanotechnology Infrastructure Network (NNIN), an integrated network of user.

With over $20M in state-of-the-art equipment, we provide the training and experience that will turn your ideas into reality. A full list of available equipment and capabilities are available online at http://lnf.umich.edu/index.php/capabilities.


NTK Technologies is a leader in IC ceramic packaging. For nearly half a century, NTK has developed specialized technologies to provide advanced ceramic IC packaging solutions for mature and start-up semiconductor companies. NTK’s technical centers support design optimization and simulation services through all development and production stages -- prototype, small volume, and volume manufacturing. With global service centers, NTK offers a wide range of packaging materials and design services for CMOS/CCD image sensors, Opto, FPGA, CPU, MPU, MCM, RF, LED substrates, Hi-Rel, satellite, automotive and medical applications. Wafer probe substrates utilizing multilayer co-fired ceramic and multilayer thin film are available. Optimum package designs for 10G to 400G. As one of the industries’ largest packaging manufacturers, NTK’s products and services have evolved to match the roadmaps of mainstream and advanced ceramic applications.


Oak Ridge National Laboratory (ORNL) is a multi-program science and technology national laboratory for the United States Department of Energy (DOE). ORNL is the largest science and energy national laboratory in the Department of Energy system. ORNL's scientific programs focus on materials, neutron science, energy, high-performance computing, systems biology and national security.


Pleora’s video interface expertise brings the advantages of the Ethernet to advanced driver assistance systems and autonomous driving applications: deliver real-time uncompressed video from multiple imaging sources to processing platforms and display panels; support higher quality image transport with no video degradation or compression requirements; video, control data, and power over a single lower cost, lighter weight cable; native multicasting support to feed video from multiple cameras into multiple receivers.

Global manufacturers rely on Pleora’s products, network standards expertise, and systems knowledge to bypass development and integration complexities in mission-critical imaging applications. Our proven expertise in real-time video delivery revolutionized the machine vision market, and today our Ethernet video interfaces are deployed in thousands of imaging applications, from automated quality inspection to image-guided surgery. Now we’re bringing new levels of user awareness and intelligence to automotive applications, with solutions that help designers quickly and cost-effectively create and prototype ADAS applications.


Sensirion is the leading manufacturer of high-quality sensors and sensor solutions for the measurement and control of humidity, and of gas and liquid flows. Millions of Sensirion's sensor components and solutions are used all over the world, including in the automotive industry, medical technology, building technology, industrial processes, and in consumer goods. Sensirion's success is based on the innovative CMOSens® technology, which combines the sensor and analysis electronics in a single semiconductor chip. Sites all around the world and a seamless distribution network mean we can be local to any customer anywhere in the world in order to provide the best possible support at every stage of the project.


The Shin-Etsu Group, utilizing resources from multiple divisions, offers an extensive product line of traditional packaging materials and materials for advanced packaging. Shin-Etsu MicroSi is the leader in thermal interface material, and we have developed an extensive line of molding compounds, encapsulents, silicon and epoxy coatings along with die attachment material. The quality of our thermal interface material is among the most advanced in semiconductor manufacturing and has a wide range of use in thermal interface material applications, some of which include thermal gels and grease, phase change materials, and high hardness silicone rubber pads.


We are a premier semiconductor sensor company developing and manufacturing MEMS-based pressure sensors and serve challenging applications in the automotive, medical, and industrial markets. We develop unique products for applications requiring ultra-low pressure ranges, extraordinary robustness in harsh environments, and extremely small size. Our integrated business model with in-house manufacturing in Silicon Valley (Milpitas, CA, USA) enables industry-leading quality and process control while offering high levels of service and flexibility. We are a member of global ELMOS Group, offering proven solutions to a range of industries, based on mixed-signal application-specific standard products (ASSPs) and ICs (ASICs), and sensor systems.


Since 1986, Sonix has pioneered many of the breakthroughs in image accuracy and process productivity that have helped wafer and chip manufacturers literally transform the world. Where others have failed, we have consistently found the right answers to very difficult problems. Today, Sonix acoustic scanning microscopes are used by leading manufacturers worldwide to perform nondestructive inspection of bonded wafers and packaged semiconductors, from the development lab to the production floor. These industry-leading systems deliver the high-resolution images and advanced diagnostic tools that semiconductor designers and fabricators need to verify reliability, qualify new designs, monitor production, pinpoint device failures and improve process control. Technology innovation and leadership are at our core. We make substantial R&D investments, discovering what the future will require and developing novel solutions to meet evolving market demands. We collaborate with our customers to address today’s needs and tomorrow’s innovations as a team. Clearer diagnostic imaging, greater analytic control, faster throughput and more responsive service and support—that’s the Sonix difference.


Since 1974, Sonoscan®, the leader in acoustic microscopy (AM), has manufactured systems in the USA and regional support laboratories in Asia, Europe and the USA for AM services. Sonoscan's proprietary C-SAM® technologies have set the standard for over 40 years. Sonoscan provides non-destructive analysis for process control and quality assurance to safeguard your MEMS products as it accurately detects defects and process variations. Sonoscan offers instruments for the laboratory and automated test systems for front, mid and back-end microelectronics, including the AW series for various wafer configurations and the FACTS2™ DF2400™ for scanning MEMS devices in trays. Collaboration with Sonoscan customers and industries has led to many innovations, patents and standards over the years. Specific to the MEMS industry, transducers were developed and built by Sonoscan for bonded wafers, hermetic/cap seal, lab-on-chip and MEMS packaging inspection, plus automated accept/reject methods for die and cavity seal mapping of a wafer.


Springer is a leading science, technology, and medical (STM) publisher. Businesses and corporations around the world partner with Springer to gain digital access to the world’s leading research via eBooks, eJournals, and expert databases in order to accelerate R&D, product and patent/IP development, and to discover new areas for growth in the fast paced global marketplace. Springer’s content spans some of today’s hottest tech areas such as: intelligent transportation, IoT, MEMS, semiconductors, Big Data, privacy, displays/thin films, eRecommenders, and beyond. Learn more at springer.com/rd or browse our collection at rd.springer.com.


ST is a global leader in the semiconductor market, serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. For more than 30 years, STMicroelectronics has been a leader in automotive technology using its unrivalled combination of product design skills, high-quality manufacturing resources and partnerships with key players in the automotive ecosystem to make cars greener, safer, more economical and more enjoyable.

The company’s automotive-solutions portfolio covers all key application areas in the car: safety, powertrain, car body, and infotainment. ST combines an unparalleled platform of advanced technologies with an unswerving commitment to quality, and a thorough understanding of the automotive market. ST is found everywhere microelectronics make a positive and innovative contribution to people's life. By getting more from technology to get more from life, ST stands for life.augmented.


TECNISCO is a process service provider of precision components. We support design and manufacturing with our “cross-edge” microprocessing technology. In particular, our processing is used in the following fields: structured glass wafers for MEMS packaging; glass microfluidics for drug discovery and chemical reaction; customized heatsinks for laser diodes and LEDs. We can provide the four following advantages by undertaking several processes as a one-stop solution partner: 1. Maintaining the stability of product quality, 2. Shortening the lead time, 3. Providing better cost-performance products and services and 4. Solving customers’ problems by crossing our technologies and developing original products. About “cross-edge” microprocessing: TECNISCO’s original technologies provide the products which meet customers’ needs best from the viewpoint of quality, cost and productivity with combined technologies, crossing five processing technologies such as: cutting, grinding, polishing, metalizing, and bonding.


As a major supplier in the semiconductor industry for more than 25 years, Teikoku Taping System specializes in designing, developing, and manufacturing custom-engineered backend semiconductor equipment used for MEMS dry film resist lamination, dicing tape-and-die attach film mounting, back grind tape lamination, and UV irradiation.


Since 1996, award-winning Texas Instruments DLP® technology has powered the world’s top display devices to deliver high-resolution images rich with color, contrast, clarity and brightness for a wide range of applications, including industrial, automotive, medical and consumer market segments. DLP technology is being used in movie theatres (DLP Cinema® products) and large-scale, professional venues and conference rooms, classrooms and home theaters. With mobile devices enabled by DLP® Pico™ technology, users have the ability to display images from the palm of their hand. Every DLP chipset features an array of microscopic mirrors that switch on and off up to 10,000 times per second. To learn more, please visit http://www.ti.com/dlp or follow TI DLP technology on Twitter at @TI_DLP.


UBOTIC Company Limited provides advanced MEMS/sensor and specialty semiconductor prototype to production with a focus on low cost open-tool and custom packaging as well as housing/lid design and fabrication.  We provide packages, lead-frame and substrate design along with fabrication of molded air cavity QFN package (AQFN), LGA cavity, over-molded QFN, SOIC cavity, stacked-die, ceramic, custom lids, molded housing, and SIP.  Additional services include both thermal and electrical modeling along with package qualification and reliability testing.  The factory is certified in TS16949:2009 and ISO9001-2008.


Unisem is a global provider of semiconductor assembly and test (OSAT) services for many of the world’s most successful electronics companies.

We offer an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding; a wide range of leadframe and substrate IC packaging; wafer level CSP; and RF, analog, digital, and mixed signal test. Our turnkey services include design, assembly, test, failure analysis, and electrical, mechanical, and thermal characterization and modeling.

Unisem is an established MEMS OSAT with several years of experience in volume consumer and automotive production, in addition to a broad package portfolio covering multiple applications. The company has factory locations in Ipoh, Malaysia; Chengdu, People’s Republic of China; Batam, Indonesia; and Sunnyvale, USA. Unisem is headquartered in Kuala Lumpur, Malaysia.


We Enable Energy: Von Roll focuses on products and systems for electrical power generation, power transmission, automotive and industrial applications. Von Roll Insulation offers electrical insulation products, systems, and services for generators, motors, transformers and automotive sensor applications. Resin Solutions for PCB and Automotive Sensors: Von Roll and Dolph’s® potting resins serve as a crucial element in safeguarding sensor systems by protecting against environment contamination, corrosion and moisture resistance, improving heat transfer, and providing superior adhesion. Von Roll and Dolph’s® potting resin product lines are ideally suited to protect most sensors, including parking sensors, speed sensors, inductive sensors, temperature sensors and positioning sensors. Von Roll provides cost-effective solutions for today’s high-volume production runs.


WACKER is among the world’s leading and most research intensive chemical companies and is a worldwide innovation partner to customers in many key global sectors. Products range from silicones for automotive, transportation, aerospace and many other diverse industries; binders and polymer additives to bioengineered pharmaceutical actives and hyperpure silicon for semiconductor and solar applications. With around 16,900 employees, WACKER generated sales of €5.29 billion (2015). Headquartered in Munich, Germany, WACKER globally has 25 production sites, 21 technical competence centers and 48 sales offices. WACKER is represented regionally in North America by WACKER Chemical Corporation in Adrian, MI. As a technology leader focusing on sustainability and a Responsible Care® member, WACKER promotes products and ideas that offer high value-added potential to ensure a better quality of life based on energy efficiency and protection of the climate and environment. WACKER is certified to ISO 9001 and RC 14001.


X-FAB is the world’s largest analog/mixed-signal foundry group manufacturing devices on silicon wafers for mixed-signal integrated circuits (ICs), CMOS sensors and MEMS. X-FAB operates from five manufacturing locations in the USA, Germany and Malaysia offering wafer capacity of over 850,000 200mm-equivalent wafers per year. X-FAB maintains compliance to ISO standards for automotive and medical foundry manufacturing and all operations are ISO/TS 16949 certified. The largest specialty fab group, X-FAB is unlike typical foundry services because of its expertise in combining advanced analog and mixed-signal CMOS process technologies with MEMS, specialized materials and wafer-level bonding and packaging. CMOS processes include options for non-volatile memory, high-voltage and high temperature. MEMS and sensors technologies include pressure sensors, inertial sensors, microphones, gas sensors, CMOS image sensors and ambient light sensors.


XYZTEC is the worldwide technology leader in bond testing. Among other tests, our system can measure wire bond strength, die shear strength, solder ball strength, strength of various epoxies and solders, bend testing circuit boards, fatigue testing, wire shear strength, substrate peel testing, tweezers pull etc. In November 2011 XYZTEC introduced the Condor Sigma, the most advanced bond tester on the market. This system utilizes a Revolving Measurement Unit (RMU) that holds up to six different sensors. This allows you to change between tests in seconds with no risk to the sensor. The RMU can handle pull/push and shear forces up to 200Kg. Additionally, you can also choose for dedicated Measurement Units for pull tests, shear tests and impact tests. Earlier this year we introduced an automation capability that utilizes fiducial pattern recognition. XYZTEC only produces bond testers. See what innovations are planned next.